Chemicals for Printed Circuit Boards

Kemplate CC 150

• Improved cleaner conditioner for better bonding and hole wall coverage
• Removes dirt, oils smut and thus ensures complete coverage by subsequent electroless copper

KEMPLATE PC 1453

• An efficient alkaline cleaner which removes oil, soils, finger prints
• Recommended for general purpose cleaning for PCB's

KEMPLATE PF 1455

• An ideal acidic liquid designed to remove the photo resist binder residues from the copper surfaces of printed circuit boards

KEMPLATE AS 1481

• An ideal acidic liquid designed to remove the photo resist binder residues from the copper surfaces of printed circuit boards

KEMPLATE E 2743

• Micro etch solution based on hydrogen peroxide and sulphuric acid Has a controlled etch rate and good stability

KEMPLATE ACTIVATOR 1444

• Concentrated activator designed for high chloride low acid formulation Specially suited for multilayer application due to its low acidity
• Attacks is kept minimum on inner layer coating and has high tolerance for copper

KEMPLATE CU 1406

• highly stable , room temperature electroless copper
• The deposit is bright dense, pink in Colour and facilities inspection of thru-holes after plating

KEMPLATE CU 1703

• high speed warm electroless copper that eliminates need For flash electroplating.
• the bath is exceptionally stable and produces dense Fine Grained bright pink colour deposit.

CUPRAMAX HT

• HIGH throw ductile acid copper plating process for Through hole platting of printed circuit boards
• highly stable easy to operate
• It is a single additive system

TEKNOLUME BRIGHT ACID TIN 

• A bright acid tin bath to provide an effective resist Metallic coating to protect the pattern area during Subsequent etching process. 
• very good sloderability and ductility

KEMTEK CU 156

• protect copper surfaces prior to solder coating and Will improve the solubility
• improve the adhesion of photo polymer film with Copper cloud laminate

PASSIVAL 80

• protecting tin plated compoments from deteriorating During storage.
• Netutralizing any residual tin plating solution left after rinsing.

CIRCASTRIP LT 232

• Highly stabilized solution used with hydrogen Peroxide for stripping of solder and tin from copper Clad printed circuit boards.
• Designed to have minimum attack on base copper

CIRCASTRIP LT 236

• a versatile stripper based on nitric acid for rapid Stripping of tin and tin lead alloys from copper clad PCB's
• minimum attack on copper.
• suitable for spray or dip applications

KEMPLATE EH 150

• EH 150 is an advanced ammonical etching system Designed for use in the volume production of Printed circuit boards
• EH 150 offers the PCB manufacturer a fast, safe And economical method of copper etching of Printed circuit boards

KEMPLATE PR 195

• kemplate PR-195 developer concentrate is a Concentrated liquid used to make up & replenish Aqueous developing solutions

KEMPLATE MB 38

• A unique process which produces uniform black copper Oxide coating on copper folis and thus improves the Bond strength between the inner layers and withstand Very well during hot air leveling or wave soldering. Also Increase the adhesion of solder mask over copper Surface.
• Specially suited to multilayer application due to its low acidity
• Attacks is kept minimum on inner layer coating and has high tolerance for copper