Chemicals for Printed Circuit Boards

KEMPLATE CC 150

• Improved cleaner conditioner for better bonding and hole wall coverage
• Removes dirt, oils and smut to ensure complete coverage by electroless copper

KEMPLATE PC 1453

• An efficient alkaline cleaner which removes oil, dirt and fingerprints
• Recommended for general purpose cleaning for PCB's

KEMPLATE PC 1455

• An ideal acidic liquid designed to remove the photo resist binder residues from the copper surfaces of printed circuit boards

KEMPLATE AD 1481

• Mild etching process designed for the preparation of copper surfaces prior to through-hole plating in printed circuit boards (PCB)

KEMPLATE E 2743

• Micro etch solution based on hydrogen peroxide and sulphuric acid.
• Controlled etch rate and good stability

KEMPLATE ACTIVATOR 1444

• Concentrated activator designed for high chloride and low acid formulation.
• Specially suited for multilayer application due to its low acidity
• Attacks are kept minimum on inner layer coating

KEMPLATE CU 1406

• Highly stable, room temperature electroless copper
• The deposit is bright, dense, pink in colour and facilitates inspection of through-holes after plating

KEMPLATE CU 1703

• High speed, warm electroless…
• The bath is exceptionally stable and produces dense, fine-grained, bright pink colour deposits

CUPRAMAX HT

• High throw, ductile acid copper plating process for through-hole platting of PCB
• Highly stable easy to operate
• Single additive system

TEKNOLUME BRIGHT ACID TIN 

• A bright acid tin bath that provides an effective metallic coating to protect the pattern area during Subsequent etching process 
• Very good solderability and ductility

KEMTEK CU 156

• Protects copper surfaces prior to solder coating
• Improves the adhesion of photopolymer film with copper-clad laminate

PASSIVAL 80

• Protecting tin plated components from deteriorating During storage
• Netutralizing any residual tin-plating solution after rinsing

CIRCASTRIP LT 232

• Highly stabilized solution used with hydrogen Peroxide for stripping of solder and tin from copper Clad printed circuit boards.
• Designed to have minimum attack on base copper

CIRCASTRIP LT 236

• A versatile stripper based on nitric acid for rapid stripping of tin and tin lead alloys from copper clad PCB's
• Minimum attack on copper
• Suitable for spray or dip applications

KEMPLATE EH 150

• EH 150 is an advanced ammonical etching system Designed for use in the volume production of Printed circuit boards
• EH 150 offers the PCB manufacturer a fast, safe and economical method of copper etching of Printed circuit boards

KEMPLATE PR 195

• Developer Concentrate is a concentrated liquid formulation used to prepare and maintain aqueous developing solutions for efficient development of photoresist during PCB fabrication

KEMPLATE MB 38

• A unique process which produces uniform black copper oxide coatings on copper foils and thus improves the bond strength between the inner layers and withstands very well during hot air leveling or wave soldering. Also Increase the adhesion of solder mask over copper Surface
• Specially suited to multilayer application due to its low acidity
• Attacks are kept minimum on inner layer coatings and has high tolerance for copper