Plating on Plastics

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Advanced plastic plating solutions providing excellent adhesion and conductive coatings for ABS plastics and other polymer substrates.

  • Kemplate 1452
  • Teknoplate EH 384
  • Kemplate Activator 1442
  • Kemplate PA 1492
  • Kemplate Ni 504
  • Microbond Activator 9446
  • Microbond CU 995

Kemplate 1452

KEMPLATE 1452
  • An alkaline soak cleaner designed to remove light grease and finger prints from the ABS plastic surface

Teknoplate EH 384

TEKNOPLATE EH 384
  • Strong acid conditioner used to micro etch the plastic surface to obtain true adhesion of plate to plastic without prior mechanical roughening

Kemplate Activator 1442

KEMPLATE ACTIVATOR 1442
  • An advanced Tin Palladium catalyst solution which catalyses ABS plastic surface to influence the metal deposition from subsequent electroless nickel or copper bath

Kemplate PA 1492

KEMPLATE PA 1492
  • To improve initial deposition of subsequent electroless copper or nickel

Kemplate Ni 504

KEMPLATE NI 504
  • A highly stable room temperature electroless nickel bath to deposit uniform conductive nickel coating on ABS plastics

Microbond Activator 9446

MICROBOND ACTIVATOR 9446
  • Acidic tin-palladium activator for direct metalizing process
  • Gives uniform strong bonding of the copper to ABS surface

Microbond CU 995

MICROBOND CU 995
  • A highly stable alkaline bath making conductive link on plastic surface
  • Used for DMS process
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Why

Industries Served

  1. Electronics
  2. Automotive
  3. PCB
  4. General Finishing

Features & Benefits

  1. Wide temperature operability
  2. Excellent brightness and levelling
  3. suitable for high-speed barrel operations.

Sustainability

Our copper processes minimize metal waste and optimize chemical usage for responsible manufacturing.